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G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI G77 — Specification for
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI G77 — Specification for
$115.50
Description
SEMI G77 — Specification for Frame Cassette for 300 mm Wafers
The dynamic test method evaluates performance during component operation and provides an indication of the steady state particle contribution due to dynamic operating conditions
1 ppm以内であることが分かっている。
Thermal equipment
2) ribbon and back electrode
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI G77 — Specification forglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards None.
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 - Superseded SEMI G77 — Specification for){kind=link}
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