Environmental testing - Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Ingestion-build-242630 BS EN 15604 specifies a

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Environmental testing - Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Ingestion-build-242630 BS EN 15604 specifies a1 Scope This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens